发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having both excellent developability and adhesion and suitable for use as a photosensitive material. <P>SOLUTION: The photosensitive resin composition contains a carboxylic organic binder (A), a compound (B) containing an ethylenically unsaturated group, a photoinitiator (C), an organic solvent (D) and a pigment (E), wherein 20-300 parts by mass of the compound (B) and 20-500 parts by mass of the pigment (E) based on 100 parts by mass of the binder (A) are contained, 1-80 parts by mass of the photoinitiator (C) based on 100 parts by mass of the compound (B) is contained, the solvent (D) occupies 60-90 wt.% of the entire photosensitive resin composition, and the binder (A) comprises a component (A<SB>1</SB>) having a weight average molecular weight of 8,000-18,000 and a component (A<SB>2</SB>) having a weight average molecular weight of 20,000-40,000 in a (A<SB>1</SB>) to (A<SB>2</SB>) ratio of 10-90 to 90-10. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004354447(A) 申请公布日期 2004.12.16
申请号 JP20030148824 申请日期 2003.05.27
申请人 QIMEI INDUSTRY CO LTD 发明人 RIN HAKUSEN
分类号 G03F7/033;C08F2/44;C08F291/06;G02B5/20 主分类号 G03F7/033
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