发明名称 |
ULTRASONIC SUBSTRATE CLEANING EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To solve the problem of cleaning equipment irradiating an ultrasonic wave carried on cleaning liquid flowing through a nozzle that an ultrasonic vibration generated from an ultrasonic vibrator attenuates in the nozzle before arriving at a substrate and thereby cleaning power on the substrate surface is reduced. SOLUTION: Parallel surface 1a of a wedge type member 1 is supported in parallel with the surface of a substrate 2 to be cleaned, and an upper surface 1b is formed at a slight angle against the parallel surface 1a of the wedge type member 1. A back surface 1c connecting the end part of the parallel surface 1a and the end part of the upper surface 1b inclines at 50-80°against the upper surface 1b. A planar ultrasonic vibrator 3 is boded to the back surface 1c and applied with an oscillation output from an oscillator 4. A cleaning liquid feeder 5 connected with a nozzle 5a for feeding cleaning liquid is provided between the parallel surface 1a of the wedge type member 1 and the surface of the substrate 2 to be cleaned. COPYRIGHT: (C)2005,JPO&NCIPI
|
申请公布号 |
JP2004356589(A) |
申请公布日期 |
2004.12.16 |
申请号 |
JP20030155685 |
申请日期 |
2003.05.30 |
申请人 |
HONDA ELECTRONIC CO LTD |
发明人 |
MIYAMOTO TOSHIAKI;MAITA YUICHI;KATO YASURO |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|