发明名称 ULTRASONIC SUBSTRATE CLEANING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To solve the problem of cleaning equipment irradiating an ultrasonic wave carried on cleaning liquid flowing through a nozzle that an ultrasonic vibration generated from an ultrasonic vibrator attenuates in the nozzle before arriving at a substrate and thereby cleaning power on the substrate surface is reduced. SOLUTION: Parallel surface 1a of a wedge type member 1 is supported in parallel with the surface of a substrate 2 to be cleaned, and an upper surface 1b is formed at a slight angle against the parallel surface 1a of the wedge type member 1. A back surface 1c connecting the end part of the parallel surface 1a and the end part of the upper surface 1b inclines at 50-80°against the upper surface 1b. A planar ultrasonic vibrator 3 is boded to the back surface 1c and applied with an oscillation output from an oscillator 4. A cleaning liquid feeder 5 connected with a nozzle 5a for feeding cleaning liquid is provided between the parallel surface 1a of the wedge type member 1 and the surface of the substrate 2 to be cleaned. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356589(A) 申请公布日期 2004.12.16
申请号 JP20030155685 申请日期 2003.05.30
申请人 HONDA ELECTRONIC CO LTD 发明人 MIYAMOTO TOSHIAKI;MAITA YUICHI;KATO YASURO
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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