| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element which enables a high frequency signal to be well inputted or output and which can keep the inside in an airtight state, and to provide a semiconductor device. SOLUTION: The package for housing a semiconductor element comprises a rectangular parallelepiped substrate 1 which is formed of an insulator and is formed with a mounting section 1a for mounting a semiconductor element 6 on a bottom face of a concave portion formed in a top face thereof, electrode 7 formed on the outer surface of the side wall of the substrate 1, line conductors which run through the side wall from the bottom face of the concave portion and are connected to the electrodes 7, and lead terminals 5 whose upper parts are brazed to the electrodes 7. The electrodes 7 have their lower ends extended to the periphery of the bottom face of the substrate, and the lead terminals 5 are bent outward so that the lower faces of their lower parts may be located on the same plane as the bottom face of the substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI
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