发明名称 Method and system for analyzing and tracking defects among a plurality of substrates such as silicon wafers
摘要 A population of data points each having three or more parameters associated therewith, such as multi-channel defect data from an optical scanner, are plotted in three dimensions, and groupings of data points are identified. Boundary surfaces are defined in the three-dimensional space for delineating groupings of data points. The different groupings correspond to different data classifications or types. Classification algorithms based on the boundary surfaces are defined. When applied to defect classification, the algorithms can be exported to an optical scanner for runtime classification of defects. An algorithm for identifying a particular grouping of data points can be defined as a Boolean combination of grouping rules from two or more different n-dimensional representations, where n can be either 2 or 3 for each representation.
申请公布号 US2004252879(A1) 申请公布日期 2004.12.16
申请号 US20040864963 申请日期 2004.06.10
申请人 ADE CORPORATION 发明人 TIEMEYER TIMOTHY R.;AKUTSU JAMES S.
分类号 G01N21/95;G06K9/62;G06T7/00;G06T11/20;(IPC1-7):G06K9/00;G01N21/00 主分类号 G01N21/95
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