| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve its effective area percentage (ratio of the chip area to the packaging area on a substrate). SOLUTION: An active element is formed in a semiconductor substrate 60 and a predetermined active element forming region 61 of the semiconductor substrate 60. One external connection electrode 62 is formed, in which the rear side of the substrate 60 of the active element formation region 61 is one electrode of the active element. Other external connection electrodes 63, 64 are formed as a part of the substrate 60, which is connected electrically to the other electrode of the active element and is formed separately from the active element forming region 61. A taper part 91 is formed at edge parts of the external connection electrodes 62, 63, 64. COPYRIGHT: (C)2005,JPO&NCIPI |
