| 摘要 |
PROBLEM TO BE SOLVED: To realize a printed wiring board having an excellent moisture resistance, by simple processes. SOLUTION: The manufacturing method of the printed wiring board has a process for laminating at least a first solder resist 4 of an organic-substance-based insulation material and a second solder resist 5 of an inorganic-substance-based insulation material on a wiring board having at least first and second electrodes 3a, 3b, a process for mounting a first circuit component 7 on the first electrodes 3a, a process for coating then the second electrodes 3b and the peripheral edge portions thereof with a sealing resin composition 8 having a flux function whose cure promoting temperature is not lower than its preliminarily heating temperature and not higher than its heating temperature, a process for so mounting then a second circuit component 9 on the second electrodes 3b as to perform thereafter a heat treatment, and a process for performing collectively by the heat treatment the solder joining of the first electrodes 3a to the first circuit component 7, the solder joining of the second electrodes 3b to the second circuit component 9, and the resin sealing of the sealing resin composition 8. COPYRIGHT: (C)2005,JPO&NCIPI
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