发明名称 MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of a laminated ceramic electronic component which permits uniform pressure bonding even when recesses and projections exist on the end face of a temporary laminated body due to the deviation of lamination of ceramic green sheets. SOLUTION: In the manufacturing method of a laminated ceramic electronic component, a plurality of ceramic green sheets are laminated to form the temporary laminate, and the temporary laminate is pressurized into at least the laminating direction of the same by a hydrostatic press to form a pressure bonded laminate while the pressure bonded laminate is calcined to obtain the laminated ceramic electronic component. A pair of rigid plates are arranged upon the hydrostatic pressing process of the temporary laminate so that the outer peripheral parts of the rigid plates are extended from the outer periphery of the temporary laminate at the upper and lower surfaces side of the same. An elastic frame body which surrounds the temporary laminate is interposed between the extended parts while these are received into a flexible package, and the package is charged into the pressurizing chamber of the hydrostatic press device under a condition that the inside of the package is deaerated/sealed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356393(A) 申请公布日期 2004.12.16
申请号 JP20030152384 申请日期 2003.05.29
申请人 KYOCERA CORP 发明人 OKUMA TAKAHITO
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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