发明名称 MOLD CLAMPING CONTROL METHOD AND MOLD CLAMPING DEVICE USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping control method capable of preventing the plastic deformation of a mold caused by the flash formed by reducing mold clamping force at the time of abnormality of injection pressure to consequently suppress the occurrence of the flash, and a mold clamping device used therein. SOLUTION: An in-mold pressure sensor 30 is provided in the mold and an in-mold pressure value obtained at the time of abnormality of injection pressure is set to a memory 41. Then, in-mold pressure is detected by the in-mold pressure sensor 30 and, when the detected value reaches a preset in-mold pressure value or above during a mold clamping state, the mold is opened by a predetermined quantity to reduce mold clamping force. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004351850(A) 申请公布日期 2004.12.16
申请号 JP20030154553 申请日期 2003.05.30
申请人 KISHIMOTO SANGYO CO LTD 发明人 MORIWAKI TAKESHI;SHIOTANI YUJI
分类号 B29C45/64;B29C45/76;(IPC1-7):B29C45/64 主分类号 B29C45/64
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