| 摘要 |
A method of forming a plating electrode is disclosed that provides an increased degree of freedom in shape and position of the plating electrode. A light shielding layer is formed on a negative resist layer in a ring shape corresponding to the edge of the negative resist layer. Then, with a projection lithography stepper, and only one type of reticle pattern, specified regions of the negative resist layer are exposed one by one. Subsequently, the portion of the negative resist layer below the light shielding layer is removed by a developing treatment, and the portion of a conductive metal layer previously covered by the removed negative resist layer 120 is exposed. This exposed portion of the conductive metal is used as the plating electrode.
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