| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus having a three-dimensional structure in which fabrication process can be simplified. <P>SOLUTION: The solid state imaging apparatus is formed by bonding a first member 104 and a second member 108. The first member 104 has a first surface on the bonding face side of the first member 104 and the second member 108, and a second surface on the side opposite to the bonding face. The second member 108 has a third surface on the bonding face side and a fourth surface on the side opposite to the bonding face. The first member 104 includes a photoelectric conversion element group 105 formed on the first surface before the first member 104 and the second member 108 are bonded, and the second member 108 includes a circuit element group 106 formed on the third surface prior to bonding. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
