TEST SOCKET, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE USING THIS

摘要

PROBLEM TO BE SOLVED: To reduce the cost and to improve the reliability with regard to a test socket for testing an mounted electronic component, its manufacturing method and the semiconductor device using the socket. SOLUTION: The test socket for testing the semiconductor 30A is provided with vias 15 for connecting between layers; a substrate part 11 laminated with a plurality of base material layers 13 on which through holes 18 are provided at the position where the pins 34 of the semiconductor device 34 are connected; and at the same time the contact parts 12 having electrode parts 20 electrically connected with the vias 15 provided on the substrate 11 and also electrically connected with the semiconductor 30A. COPYRIGHT: (C)2005,JPO&NCIPI