| 发明名称 |
Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate |
| 摘要 |
A flexible substrate used in a semiconductor package, a method of manufacturing the same, and a semiconductor package including the flexible substrate. A circuit pattern forming region is formed in an insulating substrate with a dented shape and a circuit pattern formed of a metallic material is formed in the circuit pattern forming region.
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| 申请公布号 |
US2004251537(A1) |
申请公布日期 |
2004.12.16 |
| 申请号 |
US20040864870 |
申请日期 |
2004.06.10 |
| 申请人 |
CHOI KYOUNG-SEI |
发明人 |
CHOI KYOUNG-SEI |
| 分类号 |
H01L23/12;H01L21/48;H01L23/498;H05K1/00;H05K1/11;H05K3/04;H05K3/06;H05K3/10;H05K3/12;H05K3/24;H05K3/28;H05K3/38;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
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