| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component for a semiconductor manufacturing apparatus, which sufficiently responds to the requirements for upsizing of a semiconductor wafer and for improvement of throughput by enhancing wafer transport speed; and to provide a semiconductor manufacturing apparatus using the same. <P>SOLUTION: As a component for an aeration part, such as a showerhead or a catalyst holding plate of an exhaust gas treating device, for supplying or exhausting a reaction gas or an exhaust gas, a component for a vacuum adsorption part, such as a vacuum chuck susceptor or a wafer fork for holding a wafer, or a component for a driving part, such as a wafer fork body or a lift pin, an aluminum nitride porous material having a porosity of 10-70% is used. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
