MATERIAL PROCESSING METHOD BY ULTRASHORT PULSE LASER, PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a stable processing method of a recessed portion by which accuracy of a submicron order is easily obtained without using a complicated processing process such as a lithography process.

SOLUTION: In the material processing method by an ultrashort pulse laser, a femtosecond laser 12 is irradiated to a substrate 3 formed by an insulating material 1, and the recessed portion 13 is formed for embedding and forming an electronic element 5 on the substrate.

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