| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel solution ejection production apparatus for producing a high quality, highly accuracy and high reliability pattern wiring board or a device substrate with high yield. SOLUTION: The solution ejection production apparatus ejects solution containing fine particles onto a substrate 14 by means of an ejection head 33 having an ejection opening diameter of 20μm or less to form a pattern wiring or a device. Assuming the size of the fine particle is Dp and the diameter of the ejection opening is Do, following relation is satisfied 0.0001≤Dp/Do≤0.01. The solution is ejected with the growth action force of a film boiling bubble produced in the solution instantaneously and the flying solution is elongated in the flying direction to have a length of five times or more of its diameter with the relative speed of the substrate 14 and the ejection head 33 being set at one third or less of the ejection speed. Ejection is controlled such that the end part of the pattern is connected electrically with the electrode part on the substrate 14, and the pattern at the edge part of the electrode in the connecting region is formed thicker as compared with other regions. COPYRIGHT: (C)2005,JPO&NCIPI
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