发明名称 AUTOMATIC SOLDERING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide automatic soldering equipment that can completely eliminate the occurrence of incomplete soldering, bridges, and icicles and can make sufficient wetting into through holes. SOLUTION: In this automatic soldering equipment, many cylindrical jetting ports are provided on a primary jetting nozzle and, at the same time, a secondary jetting nozzle is provided by bringing the advancing-side foamer of the secondary jetting nozzle nearer to the jetting ports arranged side by side on the leaving side. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356161(A) 申请公布日期 2004.12.16
申请号 JP20030148816 申请日期 2003.05.27
申请人 SENJU METAL IND CO LTD 发明人 ZEN MITSUO;NIKAIDO TAKAYUKI;NAKAMURA HIDEKI;MUTSUTSUJI TOSHIHIKO
分类号 B23K1/08;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/08
代理机构 代理人
主权项
地址