发明名称 |
Hybrid integrated circuit device |
摘要 |
Provided is a hybrid integrated circuit device which can more effectively stabilize a circuit configured to operate at a high speed. A hybrid integrated circuit device of the embodiment includes a metal substrate provided with an insulating layer on a surface thereof, a conductive pattern formed on a surface of the insulating layer, a semiconductor element fixed onto the conductive pattern, a lead as external connecting means fixed to the conductive pattern in the periphery of the metal substrate, and a contact portion for electrically connecting the conductive pattern electrically connected to the semiconductor element to the metal substrate in the vicinity of the semiconductor element.
|
申请公布号 |
US2004251533(A1) |
申请公布日期 |
2004.12.16 |
申请号 |
US20040813137 |
申请日期 |
2004.03.29 |
申请人 |
SUZUKI TAKESHI;OSUMI KAZUSHIGE;ICHIHASHI JUNICHI;IIMURA TOSHIYUKI;TSUYUKI SHINICHI |
发明人 |
SUZUKI TAKESHI;OSUMI KAZUSHIGE;ICHIHASHI JUNICHI;IIMURA TOSHIYUKI;TSUYUKI SHINICHI |
分类号 |
H01L25/18;H01L23/433;H01L23/495;H01L25/04;H01L25/16;H05K1/02;H05K1/05;H05K3/28;H05K3/40;H05K3/44;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|