发明名称 |
Method for and apparatus for bonding patterned imprint to a substrate by adhering means |
摘要 |
A method for bonding patterned imprint by transferring is disclosed, which comprises the following steps: (a) providing a first module having a molding substrate, a molding layer and a patterned molding features, and a second module having a substrate; wherein said molding layer and said patterned molding features are located on said molding substrate; (b) coating a release layer on said molding features; (c) filling a transfer layer into the recess which is located between the patterned molding features; (d) coating an adhesion layer on said substrate of said second module; (e) combining and contacting said second module and said first module together for transferring said transfer layer to said substrate of said second module; and (f) separating said second module from said first module.
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申请公布号 |
US2004250945(A1) |
申请公布日期 |
2004.12.16 |
申请号 |
US20030671531 |
申请日期 |
2003.09.29 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
ZHENG RUI-TING;LIN HSI-HSIANG;TSAI HUNG-YIN;SU CHIEN-CHANG;CHEN CHIEN-YANG |
分类号 |
B44C1/00;B44C1/165;G03F3/00;G03F7/00;(IPC1-7):B44C1/165 |
主分类号 |
B44C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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