发明名称 TWO-STATE THERMAL INTERFACE MATERIAL HAVING POLYGONAL SHAPE AND ATTACHED TO SURFACE OF HEAT SINK, AND METHOD FOR FORMING AND ATTACHING THERMAL INTERFACE MATERIAL
摘要 PURPOSE: A two-state thermal interface material, and a method for forming and attaching a thermal interface material are provided to effectively attach the thermal interface material to a surface of a heat sink without using a double-sided tape. CONSTITUTION: A two-state thermal interface material(700) is characterized in that the material has a polygonal shape. The material has an octagonal shape, or a square shape with cut four edges(710). A method for attaching a two-state thermal interface material to a heat sink is characterized in that a film adhesion tape is bonded to one surface of the material, and the material is attached to the heat sink such that the surface with the film adhesion tape is directed toward a heating portion of a CPU.
申请公布号 KR20040105490(A) 申请公布日期 2004.12.16
申请号 KR20030036875 申请日期 2003.06.09
申请人 THEMAXKOREA CO., LTD. 发明人 CHA, EUN JONG;JANG, JAE U;WOO, DONG WON;YOO, SEUNG MUN
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址