发明名称 ADHESIVE LAYER FORMING METHOD
摘要 An adhesive layer forming method capable of forming an adhesive layer to a specified thickness in a step for forming the adhesive layer on the surface of a member to be treated for forming a film containing powder in the member to be treated. An adhesive layer forming medium (m1) coated with an adhesive substance is collided with the member to be treated (W) to move the adhesive substance from the adhesive layer forming medium (ml) to the member to be treated (W) to form the adhesive layer on the member to be treated (W). The adhesive layer formed on the member to be treated can be formed to the specified thickness by adjusting the thickness of the adhesive substance (amount of the adhesive substance held by each of the adhesive layer forming medium) applied onto the adhesive layer forming medium. Thus, a finally form ed powder film can also be formed in a specified thickness.
申请公布号 CA2528491(A1) 申请公布日期 2004.12.16
申请号 CA20042528491 申请日期 2004.06.02
申请人 INTERMETALLICS CO., LTD. 发明人 SAGAWA, MASATO;ITATANI, OSAMU
分类号 B05D1/26;B05C3/05;B05C3/08;B05C9/02;B05D1/22;B05D1/24;B05D1/28;B05D5/10;C09J5/00;C09J7/02;C09J201/00;C23C26/00 主分类号 B05D1/26
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