| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate having a lamination structure to reduce the size thereof, and to provide a circuit module. SOLUTION: On a side face of a core material 102 which constitutes an upper substrate 100, a through-hole via terminal 114 is so formed as to be extended from a top to bottom face of the core material 102. On the bottom face of a core material 152 which constitutes a lower substrate 150, a land 158 is formed. The upper substrate 100 is stacked on the lower substrate 150. Due to this structure, connection terminals can be formed in two stages on the side face of the substrate 200 or 250 having a lamination structure, and insulation can be secured between the through-hole via connection terminal 114 in the upper stage, and the land 158 which is the connection terminal in the lower stage, resulting in the reduction in size of the substrate even when many connection terminals are needed. COPYRIGHT: (C)2005,JPO&NCIPI
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