发明名称 METHOD OF MANUFACTURING WIRING BOARD THROUGH PRESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board provided with metal foils, a metal foil and a pattern conductor layer, or pattern conductor layers which are provided adjacent to each other through the intermediary of an insulating layer and electrically connected together with a bump (projection) that is formed by the plastic deformation of the metal foil or the pattern conductor layer itself. SOLUTION: The metal foil is placed on the surface of a first type plate-like elastic body equipped with a plate-like elastic material on its surface, and a second type body equipped with a thrust pin or a projection is reciprocated with strokes long enough to enable the tip of the pressing pin or the projection to bear against the surface of the elastic material at a right angle with it and to bite into the plate-like elastic material through the intermediary of the metal foil to plastically deform the metal foil. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356181(A) 申请公布日期 2004.12.16
申请号 JP20030149100 申请日期 2003.05.27
申请人 MOTORONIKUSU:KK 发明人 SUGA KOUJI
分类号 H05K1/11;H01L21/60;H05K3/40;(IPC1-7):H01L21/60 主分类号 H05K1/11
代理机构 代理人
主权项
地址