发明名称 PASTE FOR CONDUCTOR, CERAMIC WIRING BOARD, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a paste for conductor which does not cause troubles in post processes and is excellent in printing property, and to provide a manufacturing method for a ceramic wiring board and the ceramic wiring board. SOLUTION: The paste for conductor contains a conductive component and an organic vehicle component; and is 50 to 400 Pa s in viscosity V<SB>10rpm</SB>, 3 to 8 in viscosity ratio V<SB>1rpm</SB>/V<SB>10rpm</SB>, and 3 to 8 in viscosity ratio V<SB>10rpm</SB>/V<SB>100rpm</SB>. The manufacturing method comprises an unbaked conductor pattern forming process which forms an unbaked conductor pattern on a surface of a ceramic green sheet by printing with the paste; an unbaked laminate forming process which forms an unbaked laminate on the surface of the ceramic green sheet having the unbaked conductor pattern, by stacking other ceramic green sheets so as to sandwich the unbaked conductor pattern; and a baking process for baking the unbaked laminate. The ceramic wiring board is produced by the manufacturing method. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004355862(A) 申请公布日期 2004.12.16
申请号 JP20030149824 申请日期 2003.05.27
申请人 NGK SPARK PLUG CO LTD 发明人 NAGAO YUKINOBU;SATO HIRONORI
分类号 H05K3/12;H01B1/22;(IPC1-7):H01B1/22 主分类号 H05K3/12
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