发明名称 SUBSTRATE INSPECTION APPARATUS, SUBSTRATE INSPECTION METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To acquire a detection image having the minimum distortion, the maximum S/N, and the maximum contrast. SOLUTION: Reflection electrons having nearly the same radiation energy as that of the incident energy of primary beams are used for forming images. Weight coefficients k<SB>d</SB>, k<SB>s</SB>, k<SB>c</SB>adapted to an inspection purpose are set. An image total evaluation value M(n)=k<SB>d</SB>M<SB>d</SB>+k<SB>s</SB>M<SB>s</SB>+k<SB>c</SB>M<SB>c</SB>is calculated, based on an image distortion evaluation value Md, an image S/N evaluation value Ms, and an image material contrast Mc that are evaluation values determined by digitizing the evaluation characteristics of distortion, S/N, and contrast. Accordingly, inspection conditions for obtaining the optimum substrate surface image are acquired. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004354091(A) 申请公布日期 2004.12.16
申请号 JP20030149416 申请日期 2003.05.27
申请人 TOSHIBA CORP 发明人 NAGAHAMA ICHIROTA;YAMAZAKI YUICHIRO
分类号 G01N23/203;G01R31/302;H01L21/66;(IPC1-7):G01R31/302 主分类号 G01N23/203
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