PLATING DEVICE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a plating device for an electronic component by which the generation of the defect in plating can be reduced. SOLUTION: The device is equipped with rotary shafts 13 each provided at the center of the edge face in a barrel 11 and having a through hole at the central part thereof; and electrodes 14 each drawn into the barrel 11 through the through hole 12 of the rotary shaft 13. Each electrode 14 is made gradient so as to be located down as it goes to the tip. COPYRIGHT: (C)2005,JPO&NCIPI