TAPE WITH ADHESIVE FOR SEMICONDUCTOR AND COPPER-CLAD LAMINATE USING THE SAME, SUBSTRATE FOR CONNECTING SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a novel tape with an adhesive for a semiconductor having excellent adhesive properties, high insulation properties and high heat resistance and a copper-clad laminate using the same, and to provide a substrate for connecting the semiconductor and a semiconductor device.

SOLUTION: The tape with the adhesive for the semiconductor includes an adhesive layer and a protective film layer on an organic insulating film having flexibility. The adhesive layer after curing has a micro-phase isolation structure having one or more discontinuous phases in a continuous phase. The discontinuous phase is a spherical shape. Requirements are satisfied in which (1) the mean particle size of the discontinuous phase is 0.01-0.5 μm, (2) sharpness of the particle size distribution of the discontinuous phase is 10 or more, and (3) the maximum particle size of the discontinuous phase is 20 μm or less.

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