| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card which has an IC card substrate prevented from warping due to an influence of heat. <P>SOLUTION: An antenna coil 11 and an IC module attachment part 12 for connection to an IC module are formed on an inlet sheet 10, and a notch is formed around the formed IC module attachment part 12, and the inlet sheet 10 having the notch formed is placed on the center axis in the perpendicular direction of the IC card substrate, and lamination is made symmetrical through the inlet sheet 10 in the perpendicular direction of the IC card substrate while a bottom raising part 17 is provided on the rear face of the IC module attachment part 12 so that only the IC module attachment part 12 formed on the inlet sheet 10 may be locally placed in a position where an IC module is installed. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
