发明名称 ELECTROLYSIS METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To form a plated film having a high uniformity within the surface of a substrate and uniformly etch the film, even when the substrate has a thinned electric power-supplying layer. SOLUTION: The electrolysis method comprises arranging a substrate W and a counter electrode plate 20 so as to face each other, filling a space between the substrate W and the counter electrode plate 20 with an electrolytic solution, supplying an electric power between them and electrolyzing the solution. The method further includes arranging a diaphragm 22 between the substrate W and the counter electrode plate 20, and supplying the electrolytic solutions Q<SB>1</SB>and Q<SB>2</SB>having different resistivities respectively to a substrate side region and a counter electrode side region, which are divided by the diaphragm 22. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004353061(A) 申请公布日期 2004.12.16
申请号 JP20030154809 申请日期 2003.05.30
申请人 EBARA CORP 发明人 MISHIMA KOJI;IDE KUNIHITO;SUZUKI HIDENAO;NOMURA KAZUFUMI;KANDA HIROYUKI
分类号 C25D7/12;C25C7/00;C25D5/00;C25D17/00;C25D21/04;C25D21/12;C25D21/14;H01L21/288;H01L21/445;(IPC1-7):C25D17/00 主分类号 C25D7/12
代理机构 代理人
主权项
地址
您可能感兴趣的专利