发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a ferroelectric capacitor. SOLUTION: The semiconductor device comprises: an inter-layer insulating layer formed on a substrate provided with an integrated circuit and provided with a contact hole which exposes a part of the integrated circuit; the ferroelectric capacitor formed by stacking a first electrode layer, a ferroelectric layer and a second electrode layer in the order on the inter-layer insulating layer; and an insulating side wall film covering the peripheral edge of the ferroelectric capacitor excluding the peripheral edge part of the contact hole. The second electrode layer and the integrated circuit are connected by an electrically connected wiring layer through the contact hole. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356460(A) 申请公布日期 2004.12.16
申请号 JP20030153693 申请日期 2003.05.30
申请人 OKI ELECTRIC IND CO LTD 发明人 HAYASHI TAKANAO
分类号 H01L27/10;H01L21/02;H01L21/768;H01L21/8246;H01L27/105;H01L27/115;(IPC1-7):H01L27/105 主分类号 H01L27/10
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