| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing method/device of a fine and highly reliable wiring board realizing interlayer connection with less dispersion and having high positioning precision. SOLUTION: In the manufacturing method of the wiring board, wiring (308) and an electric insulating sheet (303) where a through hole in a thickness direction is filled with conductive paste (305) are integrated. An adhesive layer and a cover film are installed on both faces of the electric insulating sheet. One of cover films is peeled, and the electric insulating sheet (303) is sucked by an alignment jig for electric insulating sheet whose center is a non-contact face (310), whose periphery is brought into contact with the electric insulating sheet (303), and which has a suction groove (302). The other cover film is peeled, and the electric insulating sheet (303) and wiring (308) are bonded by adhesive. COPYRIGHT: (C)2005,JPO&NCIPI
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