发明名称 MANUFACTURING METHOD OF SOLID STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method which can form a base mount efficiently on which an imaging element is mounted, with practically sufficient roughness. SOLUTION: An imaging device is provided with a frame-like base mount having an aperture, wiring continued and attached to the whole surface outside from the aperture side, and the imaging element 4 mounted on an attachment side of the wiring. In the method for manufacturing the imaging device, a cavity 13a for performing resin formation of the base mount 1 is formed in a first metallic mold half object 13, and a flat surface facing the cavity of the first metallic mold half object is formed on a second metallic mold half object 12. A sheet material 11 in which an electrode member 10 for forming an electrode terminal is patterned and formed is arranged between the first and the second metallic mold half objects, in such a manner that the electrode member is positioned facing the cavity. The cavity is filled with sealing resin 14 and hardened, the base mount 1 formed by burying the electrode member is extracted from the metallic mold, and the sheet material is exfoliated from the electrode member, thereby mounting the imaging element 4 on a surface of the base mount 1 in which the electrode member is buried. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356226(A) 申请公布日期 2004.12.16
申请号 JP20030149636 申请日期 2003.05.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NANO MASANORI;ONO TAKASHI
分类号 H01L27/14;H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L27/14
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