| 摘要 |
PROBLEM TO BE SOLVED: To realize the releasing of a brittle member, such as a semiconductor wafer, etc. adhered to a hard plate without damaging said member. SOLUTION: A semiconductor wafer W is adhered to one surface of the hard plate P made of a glass, etc. through a double-sided adhesive sheet to form a support unit U. A through hole P1 passing through the surface of the hard plate is formed near the outer periphery of the hard plate P. A releasing area A used to cause the semiconductor wafer to be exfoliated is formed between the hard plate and the double-sized adhesive sheet by pouring a fluid, such as water, etc. by using a syringe C into the through hole P1. Accordingly, this releasing area A can be exfoliated as an exfoliating starting position by the semiconductor wafer. COPYRIGHT: (C)2005,JPO&NCIPI
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