发明名称 Method for providing socket on substrate and socket applied with such method
摘要 A method is provided, comprising the steps of inserting the contact terminal section of the contact provided in a socket into a hole provided in the substrate, sliding the socket relative to a surface of the substrate on which the hole is formed, while maintaining the state in which the contact terminal section is inserted into the hole provided in the substrate, and fixing the socket and the contact terminal section to the substrate, while maintaining the state in which the socket and the contact terminal section are made to slide.
申请公布号 US2004253862(A1) 申请公布日期 2004.12.16
申请号 US20040864318 申请日期 2004.06.10
申请人 YAMAICHI ELECTRONICS CO., LTD. 发明人 MASAKI HIROAKI;UTSUMI TAKUMA;MATSUOKA NORIYUKI
分类号 H01L23/32;H01R13/24;H01R33/74;H01R33/76;H01R43/20;H05K3/30;(IPC1-7):H01R13/64 主分类号 H01L23/32
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