发明名称 |
Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same |
摘要 |
A semiconductor wafer provided with a thermosetting porous insulating film, wherein the insulating film is made porous, cured and polymerized on the wafer. The film is characterized by a very low dielectric constant based on its constituency and porosity, the latter property of which is caused by the inclusion of liquid or supercritical carbon dioxide in the polymeric reaction mixture.
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申请公布号 |
US2004253457(A1) |
申请公布日期 |
2004.12.16 |
申请号 |
US20040856028 |
申请日期 |
2004.05.28 |
申请人 |
HICHRI HABIB;MALONE KELLY;MARTIN ARTHUR |
发明人 |
HICHRI HABIB;MALONE KELLY;MARTIN ARTHUR |
分类号 |
C08L71/00;C09J179/08;H01L21/312;(IPC1-7):B32B9/04 |
主分类号 |
C08L71/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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