A high performance W-Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungstencoated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry. <IMAGE>
申请公布号
DE69632941(T2)
申请公布日期
2004.12.16
申请号
DE1996632941T
申请日期
1996.11.15
申请人
OSRAM SYLVANIA INC., DANVERS
发明人
DORFMAN, LEONID P.;SCHEITHAUER, MICHAEL J.;HOUCK, DAVID L.;PALIWAL, MUKTESH;MEYERS, GAIL T.;VENSKYTIS, FRANK J.