CURING RESIN, METHOD FOR PRODUCING SAME AND COMPOSITION CONTAINING SUCH CURING RESIN

摘要

A curing resin is disclosed which is a moisture-curing resin having a silyl group at the end and exhibits excellent adhesiveness when used in adhesives, sealants, coating compounds or the like. The curing resin has a silicon atom-containing group at the end of the molecule wherein one or more hydrolyzable groups such as alkoxy groups, acetoxy groups and oxime groups are directly bonded to a silicon atom. In addition, the curing resin at least has a thiourethane bond in the molecule, and the main chain skeleton of the curing resin is composed of a polyoxyalkylene polymer, a (meth)acrylate polymer or a hydrocarbon polymer.