| 摘要 |
PROBLEM TO BE SOLVED: To realize a more excellent flatness in the extreme surface of a laminated structure by suitably executing flattening processing, such as CMP (clemical and mechanical polishing) processing, in an electro-optic device, such as a liquid crystal device. SOLUTION: The electro-optic device is equipped with a TFT (thin film transistor) (202) constituting a driving circuit for driving a data line (6a) and a scanning line (11a) and an interlayer insulation film (43) formed on the data line, the scanning line, a TFT (30), and the driving circuit. At least the portion corresponding to the formed region of the driving circuit of the interlayer insulation film formed in the peripheral region is subjected to etching (a process (b)) and thereafter the peripheral region and the image display region is subjected to CMP processing (a process (c)). COPYRIGHT: (C)2005,JPO&NCIPI |
