发明名称 |
PRESSURE-SENSITIVE ADHESIVE COMPOSITE MATERIAL FOR SHIELDING ELECTROMAGNETIC WAVE |
摘要 |
PROBLEM TO BE SOLVED: To provide a composite material for shielding electromagnetic waves that has excellent dispersibility of an electroconductive filler and excellent followingness and adhesiveness to the adherend. SOLUTION: The pressure-sensitive adhesive composite material for shielding electromagnetic waves comprises a thermoplastic binder that is composed of a pressure-sensitive adhesive composition and organic synthetic fibers that are dispersed in the binder and have an electroconductive surface film layer wherein the content of the organic synthetic fiber is 1-50 %wt. based on the thermoplastic binder. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004352926(A) |
申请公布日期 |
2004.12.16 |
申请号 |
JP20030154524 |
申请日期 |
2003.05.30 |
申请人 |
THREE M INNOVATIVE PROPERTIES CO |
发明人 |
NAKAMURA SAWAKO;OKADA YUKIHISA |
分类号 |
C09J201/00;C09J11/00;C09J133/00;H01Q1/52;H05K9/00;(IPC1-7):C09J201/00 |
主分类号 |
C09J201/00 |
代理机构 |
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地址 |
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