发明名称 Semiconductor device and method of manufacturing the same
摘要 It is provided a contacting method when a plurality of films to be peeled are laminating. Reduction of total layout area, miniaturization of a module, weight reduction, thinning, narrowing a frame of a display device, or the like can be realized by sequentially laminating a plurality of films to be peeled which are once separately formed over a plastic film or the like. Moreover, reliable contact having high degree of freedom is realized by forming each layer having a connection face of a conductive material and by patterning with the use of a photomask having the same pattern.
申请公布号 US2004251461(A1) 申请公布日期 2004.12.16
申请号 US20030735710 申请日期 2003.12.16
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ANZAI AYA;MARUYAMA JUNYA
分类号 B32B9/00;G02F1/1333;H01L21/77;H01L27/12;H01L27/32;H01L31/0376;H01L31/20;H01L51/00;(IPC1-7):H01L31/037 主分类号 B32B9/00
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