发明名称 Device comprising components vertically stacked thereon and method for manufacturing the same
摘要 Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.
申请公布号 US2004250407(A1) 申请公布日期 2004.12.16
申请号 US20040888934 申请日期 2004.07.12
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YOU JAE IL;KIM JONG TAE
分类号 H01L25/00;H01L21/56;H01L25/10;H03B5/32;H05K1/18;(IPC1-7):H01G7/00 主分类号 H01L25/00
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