摘要 |
Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.
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