发明名称 Sputter target
摘要 The invention relates to a sputter target and more particularly to a zinc sputter target. The target comprises a target holder having an outer surface and a target material formed on said outer surface. The target material has a relative density higher than 92% of the theoretical density of the metal or metal alloy. Furthermore the invention relates to a process for the manufacturing of a sputter target.
申请公布号 US2004253382(A1) 申请公布日期 2004.12.16
申请号 US20040486649 申请日期 2004.03.11
申请人 DE BOSSCHER WILMERT;DELRUE HILDE;VANDERSTRAETEN JOHAN 发明人 DE BOSSCHER WILMERT;DELRUE HILDE;VANDERSTRAETEN JOHAN
分类号 C23C2/26;C23C4/08;C23C4/18;C23C14/34;C23C26/00;(IPC1-7):C25B9/00;C25B11/00;C25B13/00;C23C14/00 主分类号 C23C2/26
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