发明名称 |
Sputter target |
摘要 |
The invention relates to a sputter target and more particularly to a zinc sputter target. The target comprises a target holder having an outer surface and a target material formed on said outer surface. The target material has a relative density higher than 92% of the theoretical density of the metal or metal alloy. Furthermore the invention relates to a process for the manufacturing of a sputter target.
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申请公布号 |
US2004253382(A1) |
申请公布日期 |
2004.12.16 |
申请号 |
US20040486649 |
申请日期 |
2004.03.11 |
申请人 |
DE BOSSCHER WILMERT;DELRUE HILDE;VANDERSTRAETEN JOHAN |
发明人 |
DE BOSSCHER WILMERT;DELRUE HILDE;VANDERSTRAETEN JOHAN |
分类号 |
C23C2/26;C23C4/08;C23C4/18;C23C14/34;C23C26/00;(IPC1-7):C25B9/00;C25B11/00;C25B13/00;C23C14/00 |
主分类号 |
C23C2/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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