| 摘要 |
PROBLEM TO BE SOLVED: To provide a multipiece wiring board wherein a metalized layer adhered to the inside of a through hole is hardly peeled off when a ceramic mother board is divided into wiring board areas. SOLUTION: The multipiece wiring board is provided with splitting grooves 9 that are formed along the boarders of wiring board areas 3 on the main surface of the ceramic mother board 2 wherein the square wiring board areas 3 are arranged and formed vertically and horizontally, and a plurality of through holes 4 wherein a metalized layer 6 is adhered to their entire inside are formed crossing the splitting grooves 9. The metalized layer 6 is alternately formed in such a manner that its thin-wall and thick-wall parts gradually change in thickness in the vertical section. COPYRIGHT: (C)2005,JPO&NCIPI
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