发明名称 CONNECTION STRUCTURE OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board which can achieve a stable quality and can reduce the number of working processes. SOLUTION: The connection structure for connecting a coated electric wire and a printed wiring board includes a terminal which consists of an electric wire pressure-welding section which breaks the coating of the coated electric wire and is pressure-welded to a core wire, and a substrate contact to be pressure-welded to an electrode of the printed wiring board. The coated electric wire is inserted with pressure into the electric wire pressure-welding section of the terminal, and at the same time, the substrate contact section of the terminal is brought into contact with the printed wiring board to establish a conductivity path between the coated electric wire and the printed wiring board. The substrate contact section of the terminal has a substrate pressure-welding section to pressure-weld the printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004356337(A) 申请公布日期 2004.12.16
申请号 JP20030151495 申请日期 2003.05.28
申请人 YASKAWA ELECTRIC CORP 发明人 ITO TETSUYA;NAGAO TOSHIO
分类号 H01R4/24;H05K1/18;(IPC1-7):H05K1/18 主分类号 H01R4/24
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