| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink in which durability with respect to a temperature cycle can remarkably be improved, which is superior in heat dissipation, and which can efficiently diffuse heat from a semiconductor chip, and to provide a substrate for power module. SOLUTION: The substrate 1 for power module is provided with an insulating substrate 2 and a heat sink 8 installed on one face side of the insulating substrate 2. The heat sink 8 is provided with confronted plate-like bodies 9 made of copper whose purity is 99.9999% or above, a low thermal expansion material 10 which is inserted between the plate-like bodies 9 and 9 and is made of a material whose thermal expansion coefficient is lower than that of the plate-like bodies 9, and a casting object 19 which is cast between the plate-like bodies in a state where the low thermal expansion material 10 is sandwiched between the plate-like bodies 9 and 9 and in which the low thermal expansion material 10 is embedded. COPYRIGHT: (C)2005,JPO&NCIPI
|
