发明名称 RESIN COMPOSITION AND APPLICATION THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a resin composition exhibiting excellent adhesion to an untreated polyolefin-based resin film, sheet or molded product, hardly providing sticky feeling to a coated film, and having excellent heat-sealability at low temperature. SOLUTION: The resin composition is obtained by reacting (A) a modified resin obtained by modifying at least a part of (a) a styrenic elastomer with a functional group, with (C) a copolymerizable monomer comprising a monomer having anα,β-monoethylenic unsaturated group and other monomers copolymerizable therewith, regulated so that the weight ratio (A)/(C) may be (1/9)-(9/1), or by reacting a mixture of (A) the modified resin and (B) a polyolefin resin, with (C) the copolymerizable monomer comprising the monomer having theα,β-monoethylenic unsaturated group and other monomers copolymerizable therewith, regulated so that the weight ratio ((A)+(B))/(C) may be (1/9)-(9/1). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004352836(A) 申请公布日期 2004.12.16
申请号 JP20030151179 申请日期 2003.05.28
申请人 MITSUI CHEMICALS INC 发明人 ASAMI KEIICHI;TAKEUCHI KUNIHIKO
分类号 C08F285/00;C08F287/00;C09D151/00;C09D153/00;C09J151/00;C09J153/00;(IPC1-7):C08F285/00 主分类号 C08F285/00
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