发明名称 MANUFACTURING METHOD OF ELECTRODE SUBSTRATES
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrode substrate that forms a through hole for installing a conductive member with a finer caliber and a pitch selectively at a particular portion of the substrate and is capable of easily making the substrate large and thin. SOLUTION: The method for manufacturing the electrode substrate comprises a step of bundling and aligning a plurality of fibrous glass members 1 comprised of a core glass part 3 and a coated glass part 5 installed at the surrounding of the core glass part 3 and then heating and fusing the same to obtain bundled glass members 9b, a step of heating and fusing one or more pure glass members and one or more glass members 9b after the attachment by lamination to obtain a glass block, a step of cutting each block so that a cut surface crossing the center axis of each glass member 1 is formed to form a sheet-like glass member, a step of removing one or more core glass part 3 within the sheet-like glass member to obtain one or more through holes and a step of installing the electrode comprised of a conductive member electrically conducting between both main surfaces of the sheet-like glass member in the through hole. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004352550(A) 申请公布日期 2004.12.16
申请号 JP20030151361 申请日期 2003.05.28
申请人 HAMAMATSU PHOTONICS KK 发明人 KUSUYAMA YASUSHI;HAYASHI MASAHIRO;SHIBAYAMA KATSUMI
分类号 C03B23/20;C03B33/06;C03C15/00;C03C17/09;(IPC1-7):C03B23/20 主分类号 C03B23/20
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