| 摘要 |
A multi-chip light emitting diode (LED) package includes red, green, and blue LED chips directly bonded on a silicon substrate for a controlling integrated circuit (IC), and a carrier to which the controlling IC is attached. The multi-chip LED package has reduced volume and enhanced heat-radiating power. The chips are directly driven and controlled by the controlling IC, so that the carrier is not necessarily a printed circuit board but may be made of any solid material.
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