| 摘要 |
An electronic component device having an element (10) where a linear expansion coefficient in an x direction along one side of a rectangular shape of the element and that in a y direction perpendicular to the x direction are different and an annular electrode (14) is formed so as to surround a function portion constructed on a surface of the element, a circuit board (1) on a surface of which a second annular electrode (3) is formed at a position corresponding to the first annular electrode (14), and a solder seal frame (4) formed on a surface of at least either the first or the second annular electrode. The element (10) and the circuit board (1) are joined by the solder seal frame (4), and the function portion is airtightly sealed in a space between the element (10) and the circuit board (1). When an expansion difference between the element (10) and the circuit board (1) in the x direction is Qx and that in the y direction is Qy, in the first and the second annular electrode (14, 3) and the solder seal frame (4), the width of a band-like portion extending in a direction where the larger of the expansion differences Qx, Qy occurs is formed smaller than a band-like portion extending in a direction where the smaller of the expansion differences Qx, Qy occurs. |
