发明名称 RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEETS
摘要 A pressure-sensitive adhesive which can be cured by irradiation with an actinic radiation and is useful as a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet, more specially, a pressure-sensitive adhesive curable by the irradiation with an actinic radiation, which is liquid at ordinary temperatures and can attain practical crosslinking or curing even when irradiated with visible or ultraviolet rays in the absence of a photopolymerization initiator to form a cured film which is not discolored and is excellent in various pressure-sensitive adhesion performances, water resistance, and heat resistance. The pressure-sensitive adhesive is a composition comprising plural compounds which are each liquid at ordinary temperatures and each have two or more maleimido groups, namely, (A) a compound having maleimido groups represented by the formula (1) and (B) a compound having maleimido groups represented by the general formula (2) and/or a compound having maleimido groups represented by the general formula (3): (1) (2) (3) wherein R<1> and R<2> are each alkyl, aryl, arylalkyl, or halogeno; and R<3> is optionally substituted propylene or butylene.
申请公布号 WO2004108850(A1) 申请公布日期 2004.12.16
申请号 WO2004JP08049 申请日期 2004.06.03
申请人 TOAGOSEI CO., LTD.;KAMIYA, DAISUKE;OKAZAKI, EIICHI 发明人 KAMIYA, DAISUKE;OKAZAKI, EIICHI
分类号 C09J4/00;C09J7/02;C09J133/24;(IPC1-7):C09J4/00;C09J157/00;C09J7/00 主分类号 C09J4/00
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