发明名称 |
OPTICAL ELEMENT MODULE PACKAGE AND MANUFACTURING METHOD THEREOF, ESPECIALLY USING GLASS TYPE SEALING MATERIAL |
摘要 |
PURPOSE: An optical element module package and a manufacturing method thereof are provided to simplify a manufacturing process and to reduce manufacturing costs by using glass type sealing material to fix leads on a metallic stem. CONSTITUTION: An optical element module package of a TO-Can(Trademark) structure includes a laser diode(303), a photo diode(304), a stem(301), and a plurality of leads(302). The laser diode emits an optical signal. The photo diode monitors the optical signal outputted from the laser diode. The stem includes a first penetration hole of a long shape which penetrates both surfaces and is extended in parallel with the direction of a diameter. The plurality of leads are arranged in one row with penetrating the first penetration hole. A sealing material made of glass is filled in the first penetration hole to fix the stem and the leads.
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申请公布号 |
KR20040105271(A) |
申请公布日期 |
2004.12.16 |
申请号 |
KR20030035965 |
申请日期 |
2003.06.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KYE, YONG CHAN;PARK, MUN GYU |
分类号 |
G02B6/42;G02B6/12;H01S3/04;H01S5/00;H01S5/02;H01S5/022;H01S5/024;H01S5/0683;(IPC1-7):G02B6/42 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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