发明名称 OPTICAL ELEMENT MODULE PACKAGE AND MANUFACTURING METHOD THEREOF, ESPECIALLY USING GLASS TYPE SEALING MATERIAL
摘要 PURPOSE: An optical element module package and a manufacturing method thereof are provided to simplify a manufacturing process and to reduce manufacturing costs by using glass type sealing material to fix leads on a metallic stem. CONSTITUTION: An optical element module package of a TO-Can(Trademark) structure includes a laser diode(303), a photo diode(304), a stem(301), and a plurality of leads(302). The laser diode emits an optical signal. The photo diode monitors the optical signal outputted from the laser diode. The stem includes a first penetration hole of a long shape which penetrates both surfaces and is extended in parallel with the direction of a diameter. The plurality of leads are arranged in one row with penetrating the first penetration hole. A sealing material made of glass is filled in the first penetration hole to fix the stem and the leads.
申请公布号 KR20040105271(A) 申请公布日期 2004.12.16
申请号 KR20030035965 申请日期 2003.06.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KYE, YONG CHAN;PARK, MUN GYU
分类号 G02B6/42;G02B6/12;H01S3/04;H01S5/00;H01S5/02;H01S5/022;H01S5/024;H01S5/0683;(IPC1-7):G02B6/42 主分类号 G02B6/42
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